• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The inertial unit, IMU, of the drone is mounted on a main circuit board. The IMU (26) includes an internal temperature sensor delivering a chip temperature signal (θ ° chip). A heating component (36) is mounted on the circuit board in the vicinity of the IMU, and there is provided a thermal guide, incorporated in the circuit board, extending between the heating component and the IMU to enable a transfer to the IMU of the heat produced by the heating component. This thermal guide may in particular be a flat metallic layer incorporated in the card, in particular a ground plane. A thermal regulation circuit (44-62) receives as input the chip temperature signal (θ ° chip) and a reference temperature signal (θ ° ref), and delivers a control signal (TH_PWM) of the heating component, to control the heat input to the IMU. It is particularly possible to use this rapid rise in temperature to perform a complete calibration of the IMU in a few minutes
    公开号:FR3037672A1
    申请号:FR1555455
    申请日:2015-06-16
    公开日:2016-12-23
    发明作者:Quentin Quadrat；Cedric Chaperon；Henri Seydoux
    申请人:Parrot SA；
    IPC主号:
    专利说明:

    [0001] The invention relates to powered flying machines such as drones, including quadrocopter type rotary wing drones. The AR.Drone 2.0 or the Bebop Drone of Parrot SA, Paris, France are typical examples of such quadricopters. They are equipped with a series of sensors (accelerometers, 3-axis gyrometers, altimeters), a frontal camera capturing an image of the scene towards which the drone is directed and a vertical aiming camera capturing an image of the terrain overflown. . They are provided with multiple rotors driven by respective engines controllable in a differentiated manner to control the drone attitude and speed. Various aspects of these UAVs are described, inter alia, in EP 2,364,757 A1, EP 2,400,460 A1, EP 2,613,213 A1 or EP 2,644,220 A1 EP 2 613 214 A1 (Parrot SA). For recreational drones, the Inertial Mea- surement Unit (IMU) is made from low-cost MEMS components, the main problem being their sensitivity to temperature, because they do not correct themselves. the values output as a function of the temperature of the sensors. Or the temperature of the IMU can vary significantly, typically between + 30 ° C and + 60 ° C during a single use. In fact, at the beginning of use, the temperature of the IMU is close to the ambient temperature, but during use the heating of the components, and in particular of the processor, causes a rise in the temperature inside the body. of the drone. In the opposite direction, the start-up of the engines and a fast flight cause a flow of cold air tending to lower this temperature, which can then go up to much higher values when the drone landed on the ground, etc. These disruptive effects are all the more marked as the heat-generating components (processor, radio chip, motor switching MOSFETs, etc.) are mounted on the same circuit board as the IMU, which tends to accelerate the diffusion. calories. In fact, the error of the gyrometric signals (and, likewise, the accelerometric signals) delivered by the IMU presents a drift (bias) at the same time important (several degrees per second) and variable with the temperature. Moreover, the temperature variations of the sensors are likely to cause a hysteresis effect on the drift of the latter, which renders inaccurate the correction of the bias continuously. To compensate for this bias, the IMU is subject to a calibration procedure at the factory, consisting of varying the ambient temperature in a controlled way, to read the internal temperature of the IMU (chip temperature , given by an internal sensor at the IMU), and to measure the corresponding bias. It is thus possible to determine a bias / temperature characteristic, generally a nonlinear characteristic that can be modeled by a polynomial. The descriptor parameters of this characteristic (the coefficients of the polynomial) are stored in memory and will be used later to correct in real time the bias of the measurement delivered by the sensors, as a function of the temperature recorded at a given moment. The article by X. Niu et al. "Fast Thermal Calibration of Low-Grade Inertial Sensors and Inertial Measurements Units", Sensors, 2013, 13, pp. 12192-121417 describes such a calibration technique, and proposes, instead of allowing the ambient temperature to stabilize, to progressively vary this temperature along a continuous ramp. This temperature ramping technique makes it possible, while maintaining a sufficient calibration accuracy, to reduce the calibration process to approximately 3 hours. But this time is still excessive for mass production drones, and there remains the need for a faster calibration method, typically reduced to only a few minutes, which is compatible with high production rates in the factory.
    [0002] It would also be desirable to be able to reiterate the calibration later on the user's command, without the user having to implement a particular instrumentation, and without the duration of this recalibration being unacceptable. Finally, in all cases, it appears desirable, in order to improve the quality of the attitude measurements of the drone in use, to minimize the temperature fluctuations during the flight between cold and hot environments, and to take into account effectively the measured temperature of the IMU chip to correct bias in real time according to the characteristic bias / temperature obtained and stored during the factory pre-calibration.
    [0003] In order to solve these problems, the invention proposes a drone comprising, in a manner known per se, a main circuit board on which are mounted electronic components as well as an IMU inertial unit, comprising gyrometric sensors. measuring the instantaneous rotations of the drone in an absolute reference, and / or acceleration sensors for measuring the accelerations of the drone in this frame, the IMU including an internal temperature sensor delivering a chip temperature signal. Characteristically, according to the invention, there is further provided: a heating component mounted on the circuit board in the vicinity of the IMU; a thermal guide incorporated in the circuit board, this thermal guide extending between the heating component and the IMU so as to allow transfer to the IMU of the heat produced by the heating component; and - a thermal control circuit, receiving as input the chip temperature signal and a predetermined set temperature signal, and outputting a control signal of the heating component, so as to control the heat input to the IMU as a function of the difference between the chip temperature and the set temperature. According to various advantageous subsidiary characteristics: - a memory is also provided, keeping values of a polynomial approximating a chip bias / temperature characteristic of the IMU, and a thermal error correction circuit capable of applying to the signals raw data delivered by the IMU gyrometric and / or accelerometric sensors of the bias corrections as a function of the chip temperature, these corrections being based on the polynomial values stored in the memory; the thermal guide is a flat metallic layer incorporated in the circuit board and extending under the IMU and under the heating component, in particular a ground plane of the IMU and the heating component, connected to the common ground of the circuit board; the heating component is a bipolar transistor associated with a controlled bias stage (38) of the base of this transistor, as a function of the control signal delivered by the thermal regulation circuit; and the piloting signal delivered by the thermal regulation circuit is a PWM signal whose duty cycle is modulated as a function of the difference between the chip temperature and the set temperature. The invention also relates to a method for calibrating the IMU of such a drone, comprising, typically, the steps of: a) controlling the heating component so as to generate a gradually varying chip temperature ramp from an initial temperature to a final temperature; b) during this temperature ramp, reading the IMU bias values for a plurality of chip temperature values, and establishing a bias / temperature characteristic; c) search for a polynomial closest to the characteristic obtained in step b); and d) storing the values of the polynomial found in step c) as bias correction values of the IMU as a function of the chip temperature. According to various advantageous subsidiary features of this method: the initial temperature is an ambient temperature and the final temperature is a nominal operating temperature of the IMU; the duration of the temperature ramp of step b), from the initial temperature to the final temperature, is less than 3 minutes; step b) is executed in a static configuration of the IMU, and it is furthermore provided, after step d), a dynamic calibration of 111-MU, comprising steps of: e) setting up of the circuit board on a rotating support and application of predetermined rotations to the IMU; and f) during these predetermined rotations, read off the raw signals delivered by the IMU gyrometric sensors, and apply to these raw signals a thermal correction as a function of the chip temperature, these corrections being based on the values of polynomials stored in step d); the heating component is deactivated during steps e) and f).
    [0004] An exemplary embodiment of the present invention will now be described with reference to the accompanying drawings in which the same references designate identical or functionally similar elements from one figure to another. Figure 1 is an exploded perspective view of a drone showing, dissociated, the various internal elements thereof. Figure 2 is an enlarged partial view of the region of the circuit board carrying the IMU and the heating component.
    [0005] Figure 3 is a detail of the heating component and its piloting circuit. Figure 4 shows the chain of elements of the thermal regulation circuit of the temperature. Figure 5 is a process diagram explaining the different functions of calibration, thermal regulation and bias correction implemented by the invention.
    [0006] We will now describe an exemplary embodiment and implementation of the invention. In Figure 1, there is shown a quadrocopter type drone, with a drone body 10 comprising in the lower part a frame 12 secured to four connecting arms 14 radiating from the frame. Each arm 25 is equipped at its distal end with a propellant unit 16 comprising a motor driving in rotation a propeller 18. In the lower part, the propulsion unit 16 is extended by a stirrup forming a foot 20 on which the ground-based drone can rest. shutdown. The drone body comprises a plate 22 for receiving the main circuit board 24 carrying substantially all the electronic components of the drone, including the inertial unit thereof. The plate 22 is in the form of a monobloc element of light metal material and acts as a cooler to remove excess calories from some highly heat-generating components such as the main processor, the radio chip, the switching MOSFETs of the 3037672 6 motors, etc. The cooling effect is increased by the air flows resulting from aerodynamic effects, and possibly by starting a fan especially when the drone does not fly. Figure 2 is an enlarged view of the main circuit board 24 at the location where the inertial unit 26 is located. This inertial unit (IMU) is a component incorporating a three-axis gyrometer and a three-axis accelerometer. Typically, there is provided near the IMU 26 a heating component 28 capable of producing, in a controlled manner, thermal energy. This energy is intended to be provided to the IMU 26, via a thermally conductive element 30, which is for example a flat metal layer (copper layer) incorporated in the main circuit board and extending to both under the IMU 26 and under the heating component 28. This metal flat layer acts as a thermal guide between the heating component 28 and the IMU 26 so as to allow a transfer (symbolized by the arrows 32) to the IMU of the heat produced by the heating component. It will be noted that the IMU incorporates a sensor 34 delivering a signal for measuring its internal temperature (chip temperature of the IMU). As will be discussed in detail below, this 0 ° chip signal will be used to provide temperature control by controlled activation of the heating component 28. Figure 3 illustrates the heater 28 and its driver stage 36. The component 28 may be a simple resistor but, as illustrated, it is preferably constituted by a bipolar transistor associated with a bias stage 38 of the base of this transistor. The bias is adjusted to operate the transistor 28 in resistive mode, the heat generation occurring essentially at the collector. The transistor is, for example, a PNP of power of 2STN2550 from STMi- croelectronics. The bias divider bridge 38 of the base of the transistor 28 is controlled "on-off" by a switching transistor 40, for example a N-channel MOSFET whose gate receives a digital signal TH-PWM, which is a binary signal of PWM type (Pulse Width Modulation) whose duty cycle is between 0 and 100%. It is thus possible to control in a very fine and very reactive manner the conduction of the transistor 28, and therefore the amount of heat released by the latter, between a minimum and a maximum according to the duty cycle of the signal. TH_PWM.
    [0007] The metal planar layer 30 forming a thermal guide of the main circuit board 24 is advantageously a ground plane GND_GYRO common to the IMU 26 and to the heating component 28, this mass GND_GYRO being connected to the common ground GND of the main circuit board by a strap 42.
    [0008] Figure 4 illustrates the thermal control circuit for controlling the temperature of the IMU. It will be noted that, although these diagrams are presented in the form of block diagrams according to a standardized formalism, the implementation of the various functions is essentially software, this representation having only an illustrative character.
    [0009] This control circuit is based on a PI (proportional-integral) servocontrol, with a proportional loop 44 and a discrete integrating loop 46, 50-56. Concretely, a PI regulator is sufficient because the temperature transfer model can be approximated as being a first-order linear system so easily controllable by a simple PID even if this model is unknown. This regulation operates from an error signal e corresponding to a difference between the observed temperature, namely the chip temperature 0 ° chip (temperature of the IMU 26, measured by the sensor 34) and a reference temperature 0 ° ref stored in 48. For example 0 ° ref = 50 ° C, greater than the asymptotic temperature and lower than the maximum temperature of the IMU indicated by the manufacturer's specifications. The system operates in discrete time, corresponding to a digital sampling. It is then possible to assimilate the integral to a sum of the signal over a time period determined by the block 50, this sum being calculated by the blocks 52 to 56. The blocks 58 and 60 combine the outputs of the proportional and integrating loops. and 46 and bring the resulting signal back to a range of 0-100% (to allow cyclic control). The result is stored in a PWM register 62 and input (signal TH_PWM) to the control circuit 36 of the heating component 28. It will be noted that in the flight configurations the cooling of the card is done naturally by the plate 22. , the duty cycle of the PWM signal then being 0%. The controlled activation of the heating component 36 allows the IMU to be heated as necessary to achieve and maintain a reference temperature closest to a constant value. This accelerates the rise in temperature and quickly reaches a nominal temperature of IMU 26 which will be close to a fairly stable asymptote, where variations in bias will be minimized and have little hysteresis effect. This rapid rise in temperature will also be used to speed up the calibration process. Indeed, the calibration technique described in the article by Niu et al. gives a very good accuracy, but suffers from a major defect, namely that for a single unit the calibration requires 3 hours, and such a time is prohibitive for mass production, with a high rate, even if several cards are calibrated simultaneously. Thus, typically, the heating component is used to heat the IMU during factory calibration (or subsequent recalibration). For a factory calibration, the card is maintained in a static position, without the plate 22 (whose presence would have the effect of slowing down the rise in temperature), and the gyrometer and accelerometer biases are measured as the temperature increases. The IMU can be, for example, heated in 150 seconds from an initial temperature of + 30 ° C. to a final temperature of + 65 ° C., a time much shorter than the 20 minutes envisaged by the aforementioned article by Niu et al. . During this rise in temperature, the observed bias is stored for each temperature value (chip temperature delivered by the sensor 34), and the bias / temperature characteristic obtained is then modeled as a polynomial, for example a polynomial of third order, by implementing a conventional technique of recursive polynomial regression, the recursion avoiding having to memorize all the data.
    [0010] It should be noted that a rather high reference temperature, here + 65 ° C., is chosen which is a value higher than the reference temperature chosen for the thermal regulation in flight (which was + 50 ° C.), while remaining below the maximum temperature indicated by the manufacturer of the IMU. This makes it possible to obtain a larger polynomial: indeed, when for the correction of the values a polynomial interpolation is made beyond the range of the values, the error can become considerable, according to the degree of the polynomial. In summary, i) a factory calibration is carried out to correct the bias of the sensors over a range + 30 ° C / + 60 ° C, and ii) in flight it regulates around + 50 ° C, so that even if the temperature exceeds + 50 ° C at a given moment, the bias of the sensors will always be correctly corrected. In this way, a static calibration of the thermal biases of the gyrometers was carried out in an ultrafast manner, as well as for the accelerometer biases. This static calibration can be advantageously completed by a dynamic calibration for determining the scale factors and non-orthogonality of the sensors. The dynamic calibration consists of placing the card on a moving equipment to perform predefined rotations at a constant speed along the three axes. During this dynamic calibration, the heating component can be deactivated. During the predetermined rotations, the signals delivered by the sensors of the IMU are read and a thermal correction is applied to them as a function of the chip temperature, this thermal correction being calculated from the values of polynomials previously stored in the calibrator. - static. The temperature-corrected data are for example used in a general gradient descent type algorithm making it possible to calibrate the inertial data with respect to a theoretical rotation.
    [0011] The duration of this dynamic calibration is of the order of 45 seconds, a time quite compatible with high speed factory production. In the case of a subsequent recalibration by the user, the method is the same as for the initial static calibration at the factory. Note that this recalibration can be done easily, without disassembling the drone 3037672 10 (while the factory calibration is done on the map in isolation), with the drone in its environment, it can be repeated as needed and that it lasts only a very limited time, of the order of 2 to 3 minutes. The cooling produced by the metal platen 22, which is present during this subsequent calibration, however has the effect of reducing the maximum temperature and lengthening the calibration time. Figure 5 is a diagram explaining the different processes i) calibration, ii) thermal regulation and iii) bias correction implemented according to the invention.
    [0012] The thermal control process 70 consists in heating the IMU by the heating component 28 via its control circuit 36 and the servocontrol channel illustrated in FIG. 4. The input variables are the reference temperature (FIG. rref stored at 72 and chip temperature 0 ° chip of the IMU delivered at 74.
    [0013] The IMU calibration process 76 consists in calculating the thermal drifts of the IMU by finding the polynomial that best approximates the bias / temperature characteristic. This process can be done at the factory, or reiterated by the user if he wants to recalibrate the IMU later. The input / output data are the polynomial parameter file 78, obtained by the factory calibration, as well as, if appropriate, those of the last recalibration carried out. These files also retain parameters corresponding to the scale factor errors of the IMU, which may possibly be used in addition (reference may be made in this regard to the article by Niu et al for more details).
    [0014] The bias correction process 80 of the IMU receives as input the raw measurements of the IMU delivered at 82, the chip internal temperature 0 ° of the chip of the IMU delivered at 74, and the polynomial data. of the bias / temperature characteristic stored at 78. The bias correction is made on the basis of the current temperature of the chip, and produces temperature-corrected IMU measurements.
    权利要求:
    Claims (11)
    [0001]
    REVENDICATIONS1. A drone, comprising a main circuit board (24) on which electronic components are mounted and an IMU inertial unit (26) comprising gyrometric sensors for measuring the instantaneous rotations of the drone in an absolute reference frame, and / or accelerometric sensors for measuring the accelerations of the drone in this frame, the IMU (26) including an internal temperature sensor (34) delivering a chip temperature signal (00puce), characterized in that it comprises: - a component heater (28) mounted on the circuit board (24) adjacent to the IMU (26); a thermal guide (30) incorporated in the circuit board (24), this thermal guide extending between the heating component (28) and the IMU (26) so as to allow a transfer (32) to the IMU heat produced by the heating component; and - a thermal regulation circuit (44-62), receiving as input the chip temperature signal (0 ° chip,) and a predetermined target temperature signal (freq), and outputting a control signal (TH_PWM ) of the heating component, so as to control the heat input to the IMU as a function of the difference between the chip temperature and the set temperature.
    [0002]
    The drone of claim 1, further comprising: - a memory (78) retaining values of a polynomial approximating a chip bias / temperature characteristic of the IMU; and a thermal error correction circuit (80) capable of applying bias corrections as a function of the chip temperature to the raw signals (82) delivered by the IMU gyrometric and / or accelerometer sensors; these corrections being based on the polynomial values stored in the memory.
    [0003]
    The drone of claim 1, wherein the thermal guide is a flat metallic layer (30) incorporated in the circuit board (24) and extending under the IMU (26) and under the heating component (28). . 3037672 12
    [0004]
    4. The drone of claim 3, wherein the metal plane layer is a ground plane (GND_GYRO) of the IMU and the heating component, connected to the common ground (GND) of the circuit board.
    [0005]
    5. The drone of claim 1, wherein the heating component is a bipolar transistor associated with a controlled bias stage (38) of the base of this transistor, as a function of the control signal (TH_Pwm) delivered by the control circuit thermal.
    [0006]
    6. The drone of claim 1, wherein the control signal (TFi_Pwm) delivered by the thermal control circuit is a PWM signal whose duty cycle is modulated according to the difference between the chip temperature and the temperature of setpoint. 15
    [0007]
    A method of calibrating the IMU (26) of a drone according to claim 1, comprising the following steps: a) controlling the heating component (28) so as to generate a gradually varying chip temperature ramp; an initial temperature at a final temperature; b) during this temperature ramp, reading bias values of the IMU (26) for a plurality of chip temperature values, and establishing a bias / temperature characteristic; c) search for a polynomial closest to the characteristic obtained in step b); and d) storing the values of the polynomial found in step c) as bias correction values of the IMU according to the chip temperature. 30
    [0008]
    The method of claim 7, wherein the initial temperature is an ambient temperature and the final temperature is a nominal operating temperature of the IMU. 5 10 3037672 13
    [0009]
    The process of claim 7, wherein the duration of the temperature ramp of step b), from the initial temperature to the final temperature, is less than 3 minutes. 5
    [0010]
    The method of claim 7, wherein step b) is performed in a static configuration of the IMU, and furthermore, after step d), a dynamic calibration of the IMU is provided. IMU, comprising steps of: e) placing the circuit board on a rotating support and applying predetermined rotations to the IMU; and f) during these predetermined rotations, read off the raw signals delivered by the IMU's gyrometric sensors, and apply to these raw signals a thermal correction as a function of the chip temperature, these corrections being based on the polynomial values Stored in step d).
    [0011]
    The method of claim 10, wherein the heating component is deactivated during steps e) and f).
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    优先权:
    申请号 | 申请日 | 专利标题
    FR1555455A|FR3037672B1|2015-06-16|2015-06-16|DRONE COMPRISING IMPROVED COMPENSATION MEANS THROUGH THE INERTIAL CENTER BASED ON TEMPERATURE|FR1555455A| FR3037672B1|2015-06-16|2015-06-16|DRONE COMPRISING IMPROVED COMPENSATION MEANS THROUGH THE INERTIAL CENTER BASED ON TEMPERATURE|
    EP16173188.0A| EP3106959B1|2015-06-16|2016-06-06|Drone comprising improved means to compensate for the bias of the inertial unit in accordance with the temperature|
    US15/176,094| US10191080B2|2015-06-16|2016-06-07|Drone including advance means for compensating the bias of the inertial unit as a function of the temperature|
    CN201610422699.XA| CN106257371A|2015-06-16|2016-06-15|Including because becoming in temperature to compensate the unmanned plane of the higher-level device of inertance element deviation|
    JP2016118460A| JP2017015697A|2015-06-16|2016-06-15|Drone including advanced means of compensating for bias of inertial unit according to temperature|
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